Samsung announces 1.4nm chip roadmap, production capacity expansion
Today, Samsung announced its future plans in chip manufacturing. Dr. Si-young Choi, president of the company’s foundry business, detailed Samsung’s chip manufacturing roadmap.
According to Samsung’s plans, we should expect 2nm chips to come out of factories in 2025, while 1.4nm chips will arrive in 2027. During that period, Samsung plans to expand its foundry portfolio by 50%, and it will include non-mobile chips such as. high-performance computer chips or those used in the automotive industry. This effectively means that Samsung will triple its advanced node production.
Samsung will be able to do that by switching to a brand new strategy called Shell-First. This essentially means that future fab expansions will focus on building the so-called cleanrooms first. It is the building itself without the necessary equipment to make chips. This would allow the tech giant to be more flexible with its future production and recycle production lines quickly. The facility testing this approach is under construction in Taylor, Texas for $17 billion.
Samsung also gave us an update on its X-Cube chip packaging process, first introduced back in 2020. It allows for slimmer stacking of multiple chips. The first 3D package X-Cube hardware with micro-bump interconnect is planned for 2024, and in 2026 the design will become bumpy. This process also allows for custom chip design tailored to the customer’s specific needs.