Ambitions are there with the Dimensity 1050
The global chip shortage has shaken the mobile industry and continues to rage and allow MediaTek to lay claim to a golden opportunity. IDC reported that the company’s systems-on-chips accounted for “over 50%” share of the Android market last year, while the manufacturer itself says it’s a repeat performance at from 2020. With rumors that Samsung may turn to outside help for a top-tier smartphone release. , the middle of 2022 is proving to be an exciting time for the Taiwanese firm. And, just announced, we have a bunch of new silicon covering the mid-range and they include the company’s first crack at millimeter wave 5G.
| MediaTek | Size 1050 | Size 930 |
| Manufacturing | 6nm TSMC | |
| CPU | 2x Cortex-A78 (2.5GHz) + 6x A55 | 2x A78 (2.2GHz) + 6x A55 (2GHz) |
| GPUs | Mali-G610 MC3 arm | Imagination BXM-2-256 |
| Memory | Up to UFS3.1, 2x LPDDR5 | |
| Featured Connectivity | mmW 5G (4CC), Sub-6 5G (3CC), Wi-Fi 6E | Sub-6G 5G (2CC), LTE Cat. 15, Bluetooth 5.2 |
| Camera | Imagiq 760 ISP (108MP, HW according to HDR for two cameras) | 64MP, option for 108MP |
| Display | MiraVision 760 (Low Power FHD+ @ 144Hz) | FHD+ 120Hz with HDR10+ |
If you live where brands like “5G+” or “5G Ultra Capacity” or even “5G Ultra Wideband” are heard, MediaTek hopes you’ll see a phone or two running the Dimensity 1050. It’s the first chipset from the company’s portfolio to supports 5G millimeter wave spectrum in the n257, n258, n260 and n261 bands. Executives say their own end-to-end modem solution compares well to Qualcomm’s equivalent offering on peak transmission and even better on typical transmission and power consumption, band-for-band. And if it wasn’t already obvious, this new chip is squarely aimed at US devices, as carriers here tend to be more obsessed with millimeter wave technologies. Whether people actually use them (or are even able to) is another question, but that’s up to the networks to answer.
MediaTek is particularly concerned about the supply chain with this series of releases. The Dimensity 1050 receives a benefit from the Dimensity 9000 with its fairly capable image and AI pipelines while the GPU comes from the 8000 series, albeit in a slimmer configuration with only half of the six cores. The company is advertising the new Dimensity 930 as well as the Helio G99 which the North American market probably won’t see much of since it’s a 4G chip only. All of these SoCs will be manufactured with TSMC’s 6nm footprint – the company hopes to meet both inventory and performance iteration needs with this move, especially as the product begins to move into the next six months.
MediaTek is also teasing Wi-Fi 7 compliance with its Filogic 380 solution for integrated devices and the Filogic 880 for dedicated networking products – think routers for your home or business. The latter offers the capacity for three bands of front-haul traffic and two bands dedicated to back-haul traffic for maximum LAN speeds of up to 36 Gbps. While we’ll wait a bit longer for the 880, the 380 will help computers, smartphones and all your smart devices connect to this powerful future network with more bandwidth dedicated to each device and a theoretical maximum throughput of 6.5 Gbps. . Expect integrations with products releasing in the first half of next year.
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