Xiaomi recently unveiled 12 and 12 Pro in China with Snapdragon 8 Gen 1 chipset, and the new flagship is shown in a demolition video posted by WekiHome on Youtube. The demolition reveals that the construction of the 12 Pro is very “glass sandwich” structurally.
After breaking through the self-adhesive seal around the back panel of the glass, we can see the layout of a motherboard and camera cluster towards the top, the battery in the middle and the daughter card at the bottom that houses the charging part, speakers and haptic motor.
Many of the connectors, modules, cameras and links to the daughter board must be removed before the motherboard can come out. Snapdragon 8 Gen 1 uses heat sink film, copper foil, silicone grease and a large VC thermal plate measuring 2900 mm sq.
The 12 Pro is the first smartphone to come with the Sony IMX 707 50MP camera sensor, and the additional camera sensors include dual 50MP Samsung JN1 sensors. The main camera uses a 7-piece lens with OIS, while the others include a telephoto lens made of 5 pieces and an ultra-wide 6-piece lens. The front-facing camera is a 32 MP shooter.
Both the RAM and Storage modules on board are manufactured by SK Hynix with LPDDR5 and UFS 3.1 standards, respectively. The demolition also showed that the in-display scanner is made of a thinner, more expensive device. Finally, the vibration motor is said to be comparable to the iPhone’s Taptic Engine.
The Xiaomi 12 Pro also has a 6.73-inch LTPO AMOLED screen. A 4,600 mAh battery is capable of 120W fast wired charging and 50W fast wireless charging.